ASE Group is the world's largest provider of semiconductor packaging and test services -- flip-chip, QFN, SiP, and advanced RF packaging for MMIC and mixed-signal designs.
Advanced Semiconductor Engineering (ASE Group) is the world's largest independent provider of semiconductor packaging and test services. ASE provides the full range of packaging technologies -- from wire-bond QFP/QFN for standard ICs to flip-chip BGA, System-in-Package (SiP), and wafer-level packaging for advanced RF designs.
ICON partners with ASE to provide Indian defence and commercial customers access to advanced packaging solutions for MMIC and mixed-signal IC assemblies. This enables Indian-designed ICs to be packaged to the same standard as products from tier-1 global defence primes.
For programmes requiring packaging with MIL-STD-883 or ISRO STTL compliance, ICON manages the relationship with ASE -- handling design-for-manufacture review, package selection, and qualification documentation on behalf of the customer.
ICON facilitates access to ASE Group packaging and test services for Indian MMIC designers and defence programmes.
Contact our team to discuss licences, evaluation units, design kits, or technical support for your programme.